Fabrication
Ainira team has expertise in semiconductor plant building and construction in Europe and Asia, as well as fab operation for Tier 1 and Tier 2 manufacturers. Proprietary plans include design and architecture for AI chip gigafactory, with the equipment supplied by Advanced Semiconductor Materials Lithography (ASML).
To establish its brand, the Company will focus to growing market share and, for that, it will operate fabless in the beginning, with the production outsourced to Taiwan Semiconductor Manufacturing Company (TSMC).
ASML's world-class semiconductor equipment capabilities are instrumental in driving the advancement of semiconductor technology, enabling the production of smaller, faster, and more energy-efficient chips.
Extreme Ultraviolet (EUV) Lithography — ASML is a pioneer in EUV lithography, a cutting-edge technology that enables the production of smaller and more intricate chip designs.
Holistic Lithography Solutions — beside the lithography machines themselves, ASML provides software, metrology tools, and support services, which enable semiconductor manufacturers to optimise their lithography processes for maximum efficiency and yield.
Multiple Patterning Techniques — company’s equipment supports various multiple patterning techniques, such as self-aligned double patterning (SADP) and self-aligned quadruple patterning (SAQP), which are essential for achieving the desired feature density in advanced semiconductor manufacturing.
Overlay Control — these capabilities ensure precise alignment of multiple layers during the chip fabrication process, crucial for achieving high yields and ensuring the functionality of complex semiconductor devices.
High-Throughput Systems — which are enabling semiconductor manufacturers to produce chips at a rapid pace.
TSMC specialise in producing high-performance chips using advanced semiconductor manufacturing processes. Their capabilities in artificial intelligence chip fabrication include continuously evolving cutting-edge technologies.
Advanced Nodes — AI chips are manufactured using advanced process nodes (7nm, 5nm, and even smaller) that allow for higher transistor density and improved power efficiency, which are crucial for AI applications.
Specialised Libraries — TSMC provides libraries of IP blocks optimised for AI processing, including libraries for high-speed arithmetic operations, memory access, and specialised neural network accelerators.
Heterogeneous Integration — technologies that enable the integration of diverse components, such as CPUs, GPUs, and AI accelerators onto a single chip, which boosts performance and reduce power consumption.
Wafer-Level Packaging — such advanced packaging solutions enable the integration of multiple chips into a single package, which allows for higher bandwidth and lower latency in AI systems.
AI-Specific Optimisation — TSMC collaborates with AI chip designers to co-optimise chip architectures with their manufacturing processes, ensuring that AI chips achieve maximum performance and energy efficiency.
